The Shyft Group, a longtime North American specialty vehicle manufacturer, today announced the appointment of Colin Hindman as Chief Human Resources Officer.
In this role, Hindman will be responsible for developing and executing human resources strategy in support of the overall business direction of the company, which includes talent and change management, antidiscrimination and cultural competence initiatives, organizational and performance supervision, competitive benefits analysis and administration and employee training and development. He will report directly to Daryl Adams, President and Chief Executive Officer.
“Colin has a proven record of human resources leadership in fast-paced, global manufacturing environments, where he has played a key role in implementing highly effective strategies to support organizational growth,” Adams said. “We welcome Colin and look forward to his direction and successful implementation of HR long-term best practices at Shyft.”
Hindman has more than 20 years of diverse human resources leadership experience at the corporate, division and operating plant levels, both domestic and abroad. Previously, Hindman was chief human resources officer at Dayco, a global leader in the research, design, manufacturing and distribution of essential engine drive systems and aftermarket services for automotive, truck, construction, agriculture and industrial applications. While at Dayco, he led a corporate team of nine, as well as 17 HR directors and managers and was responsible for the company’s global acquisition, development, and engagement initiatives in support business strategies and objectives.
Prior to Dayco, Hindman spent more than 14 years at TriMas Corporation, a diversified global public manufacturer and provider of products to customers in the consumer products, aerospace and industrial end markets. Hindman held several roles of progressive responsibility at TriMas, his last of which was vice president of human resources. He additionally held human resources management positions within Dana Corporation and Wabash Technologies.
